Embedded World 2010 Virtual Press Kit

This page currently hosts the media kit for the launch of the FeaturePak I/O standard at the Embedded World 2010 trade show in Nuremberg, Germany on March 2, 2010. Download the launch kit contents by clicking on the titles in the table below. The first table contains FeaturePak initiative’s announcements and supporting materials; the table below it provides announcements and supporting materials from members of the FeaturePak initiative.

FeaturePak Initiative Materials

Document title Description
FeaturePak Initiative Launch Announcement
(March 2, 2010)
Press release announcing the launch of the FeaturePak initiative; briefly describes and outlines key features and benefits of the FeaturePak specification, lists FeaturePak initiative Charter Members, and provides perspectives regarding the FeaturePak concept from leading embedded market analysts (PDF file download)
FeaturePak Initiative Launch Announcement Supplement
(March 2, 2010)
A list of FeaturePak initiative Charter Members (including company contacts), and a list of FeaturePak-related products were showcased at Embedded World 2010 in Nuremberg, Germany in March 2010 (PDF file download)
FeaturePak Backgrounder
(periodically updated)
This FeaturePak.org article introduces the FeaturePak concept, lists its features and benefits, and provides an overview of the FeaturePak modules specification, including module dimensions, architecture, signal categories, power considerations, compliance requirements, etc.
FeaturePak Whitepaper
(periodically updated)
This eight-page “FeaturePak Whitepaper” (PDF download) provides a comprehensive overview of the FeaturePak embedded I/O expansion module standard and the FeaturePak initiative.
FeaturePak Frequently Asked Questions (FAQ)
(periodically updated)
Various questions and answers regarding the FeaturePak specification, potential FeaturePak applications, issues pertaining to the developing FeaturePak-related products, etc.


Member Company Announcements & Data Sheets

Member Company Click each title to download…
Connect Tech XtremeFP — March 2, 2010 — FeaturePak module that adds four high-speed RS-232 serial ports to a FeaturePak-compatible baseboard or single-board computer. Also provides 16 digital I/O or timer/counter capabilities. (data sheet)

PCI Express to FeaturePak adapter board — March 2, 2010 — Adapter board that allows users to install a FeaturePak module into any PCI Express system slot (data sheet)
congatec congatec AG joins FeaturePak Initiative — March 2, 2010 — Leading innovator of computer-on-module standards supports new embedded I/O expansion standard (press release)
Diamond Systems Diamond Mints “Worlds First” FeaturePak DAQ Module — March 2, 2010 — Tiny, high-accuracy data acquisition module provides snap-in A/D, D/A, and digital I/O functions for COM baseboards, SBCs, and full-custom electronic designs (press release)

Boardset Merges COM Express Cores with Triple-Play I/O — March 2, 2010 — COM Express form-factor Magellan boardset offers the advantages of both COMs and SBCs, and expands via PCI-104, SUMIT, and FeaturePak modules (press release)

Magellan — March 2, 2010 — COM Express form-factor embedded-ready subsystem with SUMIT, PCI-104, and FeaturePak expansion and configurable COM Express CPU (data sheet)


Further Information

To contact the FeaturePak Trade Association, please send an email to featurepak@gmail.com or use our contact form.

Join the FeaturePak Trade Association

Learn how your company can become a member of the FeaturePak Trade Association, here.

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