Intel Embedded Innovator magazine spotlights FeaturePak

The FeaturePak embedded I/O standard is the focus of a 3-page feature article in the Autumn 2010 edition of Intel’s Embedded Innovator magazine. The article, by Diamond Systems CEO and founder Jonathan Miller, takes a look at the synergy between FeaturePak I/O modules and Intel’s PCI Express-oriented Atom E6xx processor family (aka “Tunnel Creek”).

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About the FeaturePak Trade Association

We’re inviting all companies serving the embedded market — whether board/system suppliers, service providers, or silicon vendors — to join the FeaturePak Trade Association in order to take advantage of the benefits of this collaboration around the exciting new FeaturePak standard.
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FeaturePak spec updated to version 0.85, 0.86

The FeaturePak Specification and Design Guide has been updated. Versions 0.85 and 0.86 implement minor adjustments to the dimensions of the FeaturePak form-factor’s mounting holes (and drawing), connector PCB footprint, and edgecard connector fingers.

A table summarizing the complete revision history of the FeaturePak Specification and Design Guide appears here. Use our contact form to request a link for downloading the current version of the spec.

FeaturePak Brochure now available

This two-page color handout provides a short introduction to the FeaturePak embedded I/O standard, a list of FeaturePak expansion features and benefits, and a brief description of the FeaturePak Trade Association.
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FeaturePak Initiative Gains Members, Products, Trade Association

April 26, 2010; San Jose, Calif. — The FeaturePak initiative, unveiled last month at Embedded World in Nuremberg, Germany, today announced new members and FeaturePak-related products, and revealed that it is formally organizing as the nonprofit “FeaturePak Trade Association.”
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Early FeaturePak news coverage

Since March 2, 2010, when the FeaturePak I/O standard was launched, and now we’ve noticed the following online FeaturePak news coverage, not counting FeaturePak Trade Association members’ product announcements…
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FeaturePak arrives on Wikipedia

As of today, there’s a brand new page on Wikipedia devoted to the FeaturePak I/O expansion module standard. You can locate the FeaturePak Wikipedia listing by searching for “FeaturePak” on any page of — or just click here.

FeaturePak Whitepaper now available

This 8-page “FeaturePak Whitepaper” provides a comprehensive overview of the FeaturePak embedded I/O expansion module standard and the FeaturePak Trade Association.
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Tiny Embedded I/O Expansion Card Format Taps PCI Express

Ultra-small Personality Modules for Computer-on-Module Baseboards and Single Board Computers

March 2, 2010; Nuremberg, GERMANY — Eight companies in the global embedded computing market jointly unveiled the FeaturePak standard and products at the Embedded World tradeshow in Nuremberg today.
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FeaturePak spec version 0.83a available

The FeaturePak Specification and Design Guide has been updated. Version 0.83a had its cover page revised and confidential status removed in preparation for public release. Use our contact form to request a link for downloading the latest spec.